An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.