Invention Grant
- Patent Title: Substrate type antenna
- Patent Title (中): 基板型天线
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Application No.: US13023802Application Date: 2011-02-09
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Publication No.: US08743007B2Publication Date: 2014-06-03
- Inventor: Tutomu Kaneko , Takahisa Karakama
- Applicant: Tutomu Kaneko , Takahisa Karakama
- Applicant Address: JP Tokyo JP Nakano-shi
- Assignee: NISSEI Limited,Faverights, Inc.
- Current Assignee: NISSEI Limited,Faverights, Inc.
- Current Assignee Address: JP Tokyo JP Nakano-shi
- Agency: Crowell & Moring LLP
- Priority: JP2010-137468 20100616
- Main IPC: H01Q21/00
- IPC: H01Q21/00

Abstract:
The present invention provides a substrate type antenna capable of realizing high gain enhancement and high band enhancement in a simple configuration. In the substrate type antenna, a loop-like first joint pattern whose one spot is divided, is formed in one substrate surface of a substrate made of a dielectric material. Antennas are respectively connected to both end terminals of the first joint pattern at a position where the first joint pattern is divided. A loop-like second joint pattern formed at a position corresponding to the first joint pattern and whose one spot is divided, is formed in the other substrate surface of the substrate. A loop-like third joint pattern which is substantially concentric with the first joint pattern and which is formed at a position corresponding to the second joint pattern and whose spot is divided, is formed in the one substrate surface of the substrate. Other antennas are respectively connected to both end terminals of the third joint pattern at a position where the third joint pattern is divided.
Public/Granted literature
- US20110309989A1 Substrate Type Antenna Public/Granted day:2011-12-22
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