Invention Grant
- Patent Title: Device for monitoring thickness reduction of inner surface in heat transfer tube or inner surface in evaporation tube
- Patent Title (中): 用于监测传热管或蒸发管内表面内表面厚度的装置
-
Application No.: US13877135Application Date: 2011-09-29
-
Publication No.: US08743379B2Publication Date: 2014-06-03
- Inventor: Tetsuya Ikeda , Seiji Kagawa , Susumu Okino , Takuya Okamoto
- Applicant: Tetsuya Ikeda , Seiji Kagawa , Susumu Okino , Takuya Okamoto
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-225272 20101004
- International Application: PCT/JP2011/072319 WO 20110929
- International Announcement: WO2012/046611 WO 20120412
- Main IPC: G01B11/28
- IPC: G01B11/28

Abstract:
There is provided a device for monitoring a thickness reduction of an inner surface in a heat transfer tube or an inner surface in an evaporation tube, the device including: a movement unit which moves along a fin tube; a laser measurement unit which is provided in the movement unit and measures the thickness reduction of the inner surface by a laser; a cable which includes a light guiding path for introducing a laser into the laser measurement unit and a light deriving path for transmitting reflected light; and a thickness reduction determining unit which compares the laser measurement data with past data or standard data and determines the current thickness reduction.
Public/Granted literature
Information query