Embodiments of the subject invention relate to micromirror devices and methods of fabricating a micromirror/micromirror array. According to an embodiment, micromirrors can be fabricated from a semiconductor substrate where after forming actuators and bonding pads on a front side of the semiconductor substrate, the device is flipped over to have a portion of the back side of the substrate removed and formed to become the mirror plate surface. The subject micromirrors can allow further miniaturization of endoscopes and other optical applications without sacrificing the optical aperture through their surface mounting capabilities.