Invention Grant
US08743530B2 Electronic component and substrate module including an embedded capacitor
有权
包括嵌入式电容器的电子部件和基板模块
- Patent Title: Electronic component and substrate module including an embedded capacitor
- Patent Title (中): 包括嵌入式电容器的电子部件和基板模块
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Application No.: US13291188Application Date: 2011-11-08
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Publication No.: US08743530B2Publication Date: 2014-06-03
- Inventor: Yoichi Kuroda , Yoshio Kawaguchi
- Applicant: Yoichi Kuroda , Yoshio Kawaguchi
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-251049 20101109; JP2011-220587 20111005
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H01G4/06

Abstract:
In an electronic component and a substrate module, a laminated body includes a first capacitor conductor and a second capacitor conductor embedded therein, which define a capacitor. First and second external electrodes are connected to the first capacitor conductor and the second capacitor conductor through extraction conductors, respectively. Third and fourth external electrodes are connected to the first capacitor conductor through extraction conductors. Fifth and sixth external electrodes are connected to the second capacitor conductor through extraction conductors. On a first side surface, no external electrode having an electrical potential different from the electrical potential of the third external electrode is provided between a first end surface and the third external electrode. On the first side surface, no external electrode having an electrical potential different from the electrical potential of the fifth external electrode is provided between a second end surface and the fifth external electrode.
Public/Granted literature
- US20120113563A1 ELECTRONIC COMPONENT AND SUBSTRATE MODULE Public/Granted day:2012-05-10
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