An electronic device having a heat dissipating component is provided. The electronic device includes a circuit board, a heat pipe which is disposed on a first side of the circuit board, a heat generating device which is disposed on a second side of the circuit board opposite to the first side, a heat sink placed which is disposed on a surface of the heat generating device and absorbs heat of the heat generating device, and a connecting member which penetrates through the circuit board and thermoconductively connects the heat pipe and the heat sink.