Invention Grant
US08743560B2 Circuit board and semiconductor module including the same 有权
电路板和半导体模块包括相同的

Circuit board and semiconductor module including the same
Abstract:
In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes.
Public/Granted literature
Information query
Patent Agency Ranking
0/0