Invention Grant
- Patent Title: Circuit board and semiconductor module including the same
- Patent Title (中): 电路板和半导体模块包括相同的
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Application No.: US13198224Application Date: 2011-08-04
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Publication No.: US08743560B2Publication Date: 2014-06-03
- Inventor: Yonghoon Kim , Hyunki Kim , Heeseok Lee
- Applicant: Yonghoon Kim , Hyunki Kim , Heeseok Lee
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Muir Patent Consulting, PLLC
- Priority: KR10-2010-0089045 20100910
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/18

Abstract:
In one embodiment, a circuit board is disclosed. The circuit board includes a first metal core; a second metal core spaced apart from the first metal core in a first direction when viewed as a cross section, such that a first side of the first metal core faces a first side of the second metal core; a first electrode electrically connected to the first side of the first metal core; a second electrode electrically connected to the first side of the second metal core facing the first metal core; and a dielectric layer between the first and second electrodes.
Public/Granted literature
- US20120063108A1 CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME Public/Granted day:2012-03-15
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