Invention Grant
- Patent Title: Internal supply redundancy across memory devices configured for stacked arrangements
- Patent Title (中): 跨存储器件的内部电源冗余配置为堆叠布置
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Application No.: US14071443Application Date: 2013-11-04
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Publication No.: US08743583B1Publication Date: 2014-06-03
- Inventor: Michael C. Stephens, Jr.
- Applicant: Michael C. Stephens, Jr.
- Main IPC: G11C5/06
- IPC: G11C5/06 ; G11C5/02 ; H01L23/02 ; H01L23/12 ; H01L23/52

Abstract:
Disclosed are various embodiments related to stacked memory devices, such as DRAMs, SRAMs, EEPROMs, ReRAMs, and CAMs. For example, stack position identifiers (SPIDs) are assigned or otherwise determined, and are used by each memory device to make a number of adjustments. In one embodiment, a self-refresh rate of a DRAM is adjusted based on the SPID of that device. In another embodiment, a latency of a DRAM or SRAM is adjusted based on the SPID. In another embodiment, internal regulation signals are shared with other devices via TSVs. In another embodiment, adjustments to internally regulated signals are made based on the SPID of a particular device. In another embodiment, serially connected signals can be controlled based on a chip SPID (e.g., an even or odd stack position), and whether the signal is an upstream or a downstream type of signal.
Information query