Invention Grant
- Patent Title: Memory with temperature compensation
- Patent Title (中): 带温度补偿的内存
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Application No.: US13227249Application Date: 2011-09-07
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Publication No.: US08743641B2Publication Date: 2014-06-03
- Inventor: Chung-Kuang Chen , Han-Sung Chen , Chun-Hsiung Hung
- Applicant: Chung-Kuang Chen , Han-Sung Chen , Chun-Hsiung Hung
- Applicant Address: TW
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW
- Agency: Baker & McKenzie LLP
- Main IPC: G11C7/04
- IPC: G11C7/04

Abstract:
A memory element in which the temperature coefficient of a memory cell substantially matches the temperature coefficient of a reference cell and tuning either the temperature coefficient of a memory cell to substantially match the temperature coefficient of the reference cell provides for improved precision of sensing or reading memory element states, particularly so as to minimize the affect of temperature variations on reading and sensing states.
Public/Granted literature
- US20130058181A1 MEMORY WITH TEMPERATURE COMPENSATION Public/Granted day:2013-03-07
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