Invention Grant
- Patent Title: Integrated circuit with an adaptable contact pad reconfiguring architecture
- Patent Title (中): 具有适应性接触垫重构架构的集成电路
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Application No.: US13340873Application Date: 2011-12-30
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Publication No.: US08744368B2Publication Date: 2014-06-03
- Inventor: Love Kothari , James Bennett , Zhongmin Zhang
- Applicant: Love Kothari , James Bennett , Zhongmin Zhang
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H04B17/00
- IPC: H04B17/00

Abstract:
An apparatus and method are disclosed for providing test mode contact pad reconfigurations that expose individual internal functional modules or block groups in an integrated circuit for testing and for monitoring. A plurality of switches between each functional module switches between passing internal signals among the blocks and passing in/out signals external to the block when one or more contact pads are strapped to input a pre-determined value. Another set of switches between the functional modules and input/output contact pads switch between functional inputs to and from the functional modules and monitored signals or input/output test signals according to the selected mode of operation.
Public/Granted literature
- US20130043939A1 Integrated Circuit With an Adaptable Contact Pad Reconfiguring Architecture Public/Granted day:2013-02-21
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