Invention Grant
US08744548B2 Lead apparatus 有权
铅装置

Lead apparatus
Abstract:
A lead including one or more electrodes having circuitry associated therewith. Each such electrode includes a circuit extending along and conforming to at least a portion of an inner surface of the electrode. The circuit includes an isolation substrate contacting at least a portion of the inner surface of the cylindrical electrode portion, a first contact electrically isolated from the electrode portion by the isolation substrate and an integrated circuit electrically coupled to the first contact and the electrode.
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