Invention Grant
- Patent Title: Lead apparatus
- Patent Title (中): 铅装置
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Application No.: US12795236Application Date: 2010-06-07
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Publication No.: US08744548B2Publication Date: 2014-06-03
- Inventor: Rogier Receveur , Jean Joseph Gerardus Rutten , Karel F. A. A. Smits , Nicolaas M Lokhoff , Sylvia Weijzen-Engels , Didier Billy , Tim Dirk Jan Jongen , Lilian Kornet
- Applicant: Rogier Receveur , Jean Joseph Gerardus Rutten , Karel F. A. A. Smits , Nicolaas M Lokhoff , Sylvia Weijzen-Engels , Didier Billy , Tim Dirk Jan Jongen , Lilian Kornet
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Reed A. Duthler
- Main IPC: A61B5/042
- IPC: A61B5/042 ; A61N1/05

Abstract:
A lead including one or more electrodes having circuitry associated therewith. Each such electrode includes a circuit extending along and conforming to at least a portion of an inner surface of the electrode. The circuit includes an isolation substrate contacting at least a portion of the inner surface of the cylindrical electrode portion, a first contact electrically isolated from the electrode portion by the isolation substrate and an integrated circuit electrically coupled to the first contact and the electrode.
Public/Granted literature
- US20110024186A1 LEAD APPARATUS Public/Granted day:2011-02-03
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