Invention Grant
- Patent Title: Substrate processing apparatus, and substrate transport method
- Patent Title (中): 基板处理装置和基板输送方法
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Application No.: US13183077Application Date: 2011-07-14
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Publication No.: US08744614B2Publication Date: 2014-06-03
- Inventor: Eisaku Machida
- Applicant: Eisaku Machida
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2010-159708 20100714
- Main IPC: G06F17/00
- IPC: G06F17/00

Abstract:
By a first transport robot, n substrates are unloaded from a first retaining portion, then simultaneously transported, and respectively loaded into n substrate holders consecutively arranged from one side defined with respect to an arrangement direction. Thereafter, a rotation mechanism rotates n+m substrate holders so as to perform a substrate inverting operation and so as to arrange the n+m substrate holders along the arrangement direction in an arrangement sequence reverse to a pre-rotation arrangement sequence. Thereafter, the n substrates loaded into the n substrate holders are unloaded in a group of m in a sequence from the one side, and loaded into a second retaining unit by a second transport robot. After the substrate inverting operation, n substrates are unloaded from the first retaining unit, and loaded again into n substrate holders consecutively arranged from the one side by the first transport robot.
Public/Granted literature
- US20120016516A1 SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE TRANSPORT METHOD Public/Granted day:2012-01-19
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