Invention Grant
- Patent Title: Inter-processor communication apparatus and method
- Patent Title (中): 处理器间通信装置和方法
-
Application No.: US13252276Application Date: 2011-10-04
-
Publication No.: US08745291B2Publication Date: 2014-06-03
- Inventor: Meir Tsadik , Albert Yosher
- Applicant: Meir Tsadik , Albert Yosher
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Main IPC: G06F5/00
- IPC: G06F5/00

Abstract:
Inter-processor communication (IPC) apparatus and a method for providing communication between two processors having a shared memory, the IPC apparatus including an arbitrated bus coupling the processors to one another and to the memory, a buffer in the shared memory associated with each processor, and at least one pair of First In First Out hardware units (FIFOs) coupled to each processor, the FIFOs holding pointers to addresses in the buffer associated with that processor, wherein a first of the pair of FIFOs (an empty buffer FIFO) is configured to hold pointers to empty portions of the buffer while the second of the pair of FIFOs (a message FIFO) is configured to hold pointers to portions of the buffer having data therein.
Public/Granted literature
- US20130086286A1 INTER-PROCESSOR COMMUNICATION APPARATUS AND METHOD Public/Granted day:2013-04-04
Information query