Invention Grant
- Patent Title: Reducing impact of a switch failure in a switch fabric via switch cards
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Application No.: US13708157Application Date: 2012-12-07
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Publication No.: US08745438B2Publication Date: 2014-06-03
- Inventor: William J. Armstrong , John M. Borkenhagen , Martin J. Crippen , Dhruv M. Desai , David R. Engebretsen , Philip R. Hillier, III , William G. Holland , James E. Hughes , James A. O'Connoor , Steven M. Tri
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Patterson & Sheridan LLP
- Main IPC: G06F11/00
- IPC: G06F11/00

Abstract:
Techniques are disclosed for reducing impact of a switch failure in a switch fabric. In one embodiment, a server system is provided that includes a midplane, one or more server cards and one or more switch cards. The midplane may include a fabric interconnect for a switch fabric. The one or more server cards may be coupled with the midplane, where each server card is hot-swappable from the midplane. The one or more switch cards may also be coupled with the midplane, where each switch card is also hot-swappable from the midplane. Each switch card includes one or more switch modules, and each switch module is configured to switch network traffic for at least one server card.
Public/Granted literature
- US20130094351A1 REDUCING IMPACT OF A SWITCH FAILURE IN A SWITCH FABRIC VIA SWITCH CARDS Public/Granted day:2013-04-18
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