Invention Grant
- Patent Title: Method of on-board wiring
- Patent Title (中): 车载接线设计方法
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Application No.: US13705229Application Date: 2012-12-05
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Publication No.: US08745562B2Publication Date: 2014-06-03
- Inventor: Masashi Inagaki , Kouji Ichikawa , Makoto Tanaka , Hideki Kashiwagi
- Applicant: Denso Corporation
- Applicant Address: JP Kariya
- Assignee: DENSO CORPORATION
- Current Assignee: DENSO CORPORATION
- Current Assignee Address: JP Kariya
- Agency: Posz Law Group, PLC
- Priority: JP2011-276081 20111216
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A design method of on-board wiring for a designed circuit includes determining a severity as a crosstalk prevention index for a pair of wires based on a generated noise level of a damaging side wire and a permissible noise level of a damaged side wire. The pair of wires is then assigned a severity class (SC) based on the severity determined. The SC is a pre-defined value range(s) for severity classification. Based on a preset SC specific permissible value list, one or more by-design permissible values belonging to the SC is generated for a design element of the pair of wires. A layout of the pair of wires on a board is constructed based on the by-design permissible value.
Public/Granted literature
- US20130159954A1 DESIGN METHOD OF ON-BOARD WIRING Public/Granted day:2013-06-20
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