Invention Grant
- Patent Title: Method of coupling digitizing sensors to a structure
- Patent Title (中): 将数字化传感器耦合到结构的方法
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Application No.: US12851424Application Date: 2010-08-05
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Publication No.: US08745864B2Publication Date: 2014-06-10
- Inventor: Seth S. Kessler , Jeong-Beom Ihn , Christopher T. Dunn , Jeffrey Lynn Duce , Michael G. Borgen
- Applicant: Seth S. Kessler , Jeong-Beom Ihn , Christopher T. Dunn , Jeffrey Lynn Duce , Michael G. Borgen
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Toler Law Group, PC
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H05K13/00
Abstract:
Systems and methods of coupling digitizing sensors to a structure are disclosed. A particular method includes applying one or more communication traces and one or more power traces to a structure using at least one direct-write technique. The method may also include coupling the one or more communication traces to at least one digitizing sensor. The method may also include coupling the one or more power traces to the at least one digitizing sensor.
Public/Granted literature
- US20110222225A1 SYSTEMS AND METHODS OF COUPLING DIGITIZING SENSORS TO A STRUCTURE Public/Granted day:2011-09-15
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