Invention Grant
- Patent Title: Method and apparatus for flooring
- Patent Title (中): 地板的方法和装置
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Application No.: US13861690Application Date: 2013-04-12
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Publication No.: US08745949B1Publication Date: 2014-06-10
- Inventor: Chao Kang Pien
- Applicant: Chao Kang Pien
- Agent Walter J. Tencza, Jr.
- Main IPC: E04B1/38
- IPC: E04B1/38 ; E04C1/40
Abstract:
An apparatus for flooring including a first connecting piece, a first floor plank, a second connecting piece, and a second floor plank. The first connecting piece may be permanently connected to the first floor plank. The second connecting piece may be permanently connected to the second floor plank. The first floor plank may be temporarily connected to the second floor plank. The first connecting piece may be L-shaped, having a first section and a second section, with the first section of the first connecting piece substantially perpendicular to the second section of the first connecting piece. The second connecting piece may be L-shaped, having a first section and a second section, with the first section of the second connecting piece substantially perpendicular to the second section of the second connecting piece.
Information query
