Invention Grant
- Patent Title: Heat pump apparatus
- Patent Title (中): 热泵设备
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Application No.: US13057362Application Date: 2009-03-05
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Publication No.: US08745999B2Publication Date: 2014-06-10
- Inventor: Mamoru Hamada , Fumitake Unezaki , Yoshihiro Takahashi , Kengo Takahashi , Kazuki Okada , Shinichi Uchino
- Applicant: Mamoru Hamada , Fumitake Unezaki , Yoshihiro Takahashi , Kengo Takahashi , Kazuki Okada , Shinichi Uchino
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2008-223531 20080901
- International Application: PCT/JP2009/054147 WO 20090305
- International Announcement: WO2010/023975 WO 20100304
- Main IPC: F25D21/06
- IPC: F25D21/06

Abstract:
A heat pump apparatus includes a refrigerant circuit in which a compressor, a condenser, expansion means, and an evaporator are serially connected. Condensation temperature detection means that detects a saturation temperature of the condenser, and evaporation temperature detection means that detects the saturation temperature of the evaporator are provided. Operation efficiency is estimated by a value obtained by dividing heating ability estimated from a detection value of the condensation temperature detection means by a difference between a detection value of condensation temperature detection means and that of evaporation temperature detection means or dissipation power estimated by the difference.
Public/Granted literature
- US20110132019A1 HEAT PUMP APPARATUS Public/Granted day:2011-06-09
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