Invention Grant
- Patent Title: Coating die and manufacturing method of enameled wire using same
- Patent Title (中): 涂漆模具及使用其的漆包线的制造方法
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Application No.: US13335992Application Date: 2011-12-23
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Publication No.: US08746165B2Publication Date: 2014-06-10
- Inventor: Masayoshi Goto
- Applicant: Masayoshi Goto
- Applicant Address: JP Tokyo
- Assignee: Hitachi Metals, Ltd.
- Current Assignee: Hitachi Metals, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2010-286975 20101224; JP2011-270308 20111209
- Main IPC: B05C1/04
- IPC: B05C1/04 ; B05C1/00

Abstract:
There is provided a coating die for applying an insulation varnish around a wire conductor, comprising: a die body; and a die hole formed through the die body, the die hole including: an entry portion having an opening size monotonically decreasing along a conductor insertion direction; and a coating portion comprising a sub-portion having a constant opening size, in which: on an inner surface of the coating portion are provided at least four protrusions equally spaced in a circumferential direction of the inner surface, the protrusions projecting toward a center axis of the die hole; and each of the protrusions includes a portion with a height gradually increasing along the conductor insertion direction from a boundary between the entry portion and the coating portion. There can be formed an enameled wire having a thin and uniform insulation coating by using the invented coating die.
Public/Granted literature
- US20120164315A1 COATING DIE AND MANUFACTURING METHOD OF ENAMELED WIRE USING SAME Public/Granted day:2012-06-28
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