Invention Grant
- Patent Title: Liquid heat-dissipating module
- Patent Title (中): 液体散热模块
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Application No.: US13044126Application Date: 2011-03-09
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Publication No.: US08746326B2Publication Date: 2014-06-10
- Inventor: Hao Jan Mou , Ta Wei Hsueh , Ying Lun Chang , Rong Ho Yu , Shih Chang Chen
- Applicant: Hao Jan Mou , Ta Wei Hsueh , Ying Lun Chang , Rong Ho Yu , Shih Chang Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Microjet Technology Co., Ltd.
- Current Assignee: Microjet Technology Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: CN201010157982 20100329
- Main IPC: F28F7/00
- IPC: F28F7/00 ; H05K7/20

Abstract:
The present invention is related to a liquid heat-dissipating module, for dissipating the heat generated by a heating element, at least comprising: a heat-absorbing unit, being connected with the heating element, for absorbing the heat generated by the heating element; a fluid delivery device, for delivering a fluid, the fluid delivery device being stacked with the heat-absorbing unit and having a heat-dissipating structure; and a connecting pipe, being connected with the heat-absorbing unit and the fluid delivery device for delivering the fluid into the heat-absorbing unit, so as to absorb the heat of the heat-absorbing unit; the fluid absorbing the heat is then delivered back to the fluid delivery device, letting the heat-dissipating structure to dissipate the heat contained in the fluid.
Public/Granted literature
- US20110232872A1 LIQUID HEAT-DISSIPATING MODULE Public/Granted day:2011-09-29
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