Invention Grant
- Patent Title: Wiper blade package
-
Application No.: US14019782Application Date: 2013-09-06
-
Publication No.: US08746450B2Publication Date: 2014-06-10
- Inventor: In Kyu Kim , Kyung Jong Nam
- Applicant: ADM21 Co., Ltd. , In Kyu Kim
- Applicant Address: KR Seoul
- Assignee: The Korea Development Bank
- Current Assignee: The Korea Development Bank
- Current Assignee Address: KR Seoul
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0100275 20120911; KR10-2013-0098267 20130820
- Main IPC: B65D83/00
- IPC: B65D83/00

Abstract:
A wiper blade package has a mouth portion that is openable by being pressed in a lateral direction. The wiper blade package has a first panel, a second panel opposed to the first panel, and a pair of side panels. The first panel is bendable around a bend line extending in a longitudinal direction and has a lid flap at its end. The lid flap is foldable around the bend line and is pivotable around a hinge line intersecting the bend line. The second panel has an engagement flap at its end. The lid flap engages a free end of the engagement flap at its free end and thereby closes a receiving portion in which a wiper blade is received. The lid flap is pivoted from the engagement flap by pressing the side panels toward the receiving portion and thereby opens the receiving portion.
Public/Granted literature
- US20140069847A1 WIPER BLADE PACKAGE Public/Granted day:2014-03-13
Information query