Invention Grant
- Patent Title: Resealable package film
- Patent Title (中): 可重复封装薄膜
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Application No.: US13670135Application Date: 2012-11-06
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Publication No.: US08746490B2Publication Date: 2014-06-10
- Inventor: Scott William Huffer , Donovan Young
- Applicant: Sonoco Development, Inc.
- Applicant Address: US SC Hartsville
- Assignee: Sonoco Development, Inc.
- Current Assignee: Sonoco Development, Inc.
- Current Assignee Address: US SC Hartsville
- Agency: Flaster/Greenberg, P.C.
- Main IPC: B65D77/20
- IPC: B65D77/20 ; B65B7/28

Abstract:
A package film is provided for attaching to a base member to define a package. The package film construction includes a top layer having a top surface and a bottom surface. A removable adhesive is provided having a defined pattern applied below the bottom surface. A polyethylene (PE) emulsion layer is provide that covers at least a portion of the adhesive pattern, with the PE emulsion layer being heat sealable to the base member.
Public/Granted literature
- US20140124507A1 RESEALABLE PACKAGE FILM Public/Granted day:2014-05-08
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