Invention Grant
US08746855B2 Method for manufacturing piezoelectric element, piezoelectric element, liquid ejecting head, and liquid ejecting apparatus 有权
制造压电元件,压电元件,液体喷射头和液体喷射装置的方法

  • Patent Title: Method for manufacturing piezoelectric element, piezoelectric element, liquid ejecting head, and liquid ejecting apparatus
  • Patent Title (中): 制造压电元件,压电元件,液体喷射头和液体喷射装置的方法
  • Application No.: US13429103
    Application Date: 2012-03-23
  • Publication No.: US08746855B2
    Publication Date: 2014-06-10
  • Inventor: Masahisa Nawano
  • Applicant: Masahisa Nawano
  • Applicant Address: JP Tokyo
  • Assignee: Seiko Epson Corporation
  • Current Assignee: Seiko Epson Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Workman Nydegger
  • Priority: JP2011-066812 20110324
  • Main IPC: B41J2/045
  • IPC: B41J2/045
Method for manufacturing piezoelectric element, piezoelectric element, liquid ejecting head, and liquid ejecting apparatus
Abstract:
A piezoelectric element is manufactured in a method including forming an adhesion layer of zirconium above a zirconium oxide insulating film, forming a first electrode above the adhesion layer, forming a piezoelectric layer of a complex oxide containing bismuth above the first electrode, and forming a second electrode above the piezoelectric layer.
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