Invention Grant
US08746927B1 Systems, methods, and devices for providing flexible heat sinks to light modules
有权
用于向光模块提供柔性散热器的系统，方法和设备
- Patent Title: Systems, methods, and devices for providing flexible heat sinks to light modules
- Patent Title (中): 用于向光模块提供柔性散热器的系统，方法和设备
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Application No.: US13103519Application Date: 2011-05-09
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Publication No.: US08746927B1Publication Date: 2014-06-10
- Inventor: Jeffrey Brian Nepple , Adrian Thomas Ehresman , Peter J. Menard
- Applicant: Jeffrey Brian Nepple , Adrian Thomas Ehresman , Peter J. Menard
- Applicant Address: US TX Houston
- Assignee: Cooper Technologies Company
- Current Assignee: Cooper Technologies Company
- Current Assignee Address: US TX Houston
- Agency: King & Spalding LLP
- Main IPC: F21V29/00
- IPC: F21V29/00
Abstract:
An LED-based light fixture that includes a light fixture housing forming a light emission aperture, one or more LEDs attached to a circuit board that is surrounded by the light fixture housing and emits light through the light emission aperture when powered. The LED-based light fixture further includes at least one flexible heat sink member that is thermally coupled with at least a portion of the circuit board and the light fixture housing.
Information query
