An optical interconnect assembly provides board to board interconnect in an electronic system. The optical interconnect assembly can include a plurality of optical fibers, having a connector disposed at the first ends, and a rigid optical mount disposed at the second ends. The rigid optical mount holds the optical fibers in alignment and in optical communication with a plurality of optical transducers mounted on the optical mount. Electrical contacts coupled to the optical transducers enable solder-attachment of one end of the optical interconnect assembly to a circuit board.