Invention Grant
- Patent Title: Multilayer molding apparatus and injection molding method
- Patent Title (中): 多层成型设备和注塑成型方法
-
Application No.: US13398407Application Date: 2012-02-16
-
Publication No.: US08747094B2Publication Date: 2014-06-10
- Inventor: Akio Okamoto , Kazuaki Miyamoto , Toshikazu Iwamoto , Atsushi Shinada , Etsuji Ota
- Applicant: Akio Okamoto , Kazuaki Miyamoto , Toshikazu Iwamoto , Atsushi Shinada , Etsuji Ota
- Applicant Address: JP
- Assignee: UBE Machinery Corporation, Ltd.
- Current Assignee: UBE Machinery Corporation, Ltd.
- Current Assignee Address: JP
- Agency: Clark Hill PLC
- Priority: JP2011-041072 20110228
- Main IPC: B29C45/04
- IPC: B29C45/04

Abstract:
A multilayer molding apparatus, comprising: a fixed platen; a movable platen; an intermediate platen positioned between the fixed platen and the movable platen to be movable in the direction to come close or be opened, and having a surface facing the fixed platen, a surface facing the movable platen, and a housing space that goes therethrough from the surface facing the fixed platen to the surface facing the movable platen; and a rotary platen rotatably supported by the intermediate platen inside the housing space of the intermediate platen, and having at least one pair of parallel surfaces facing the fixed platen and the movable platen, wherein at least one of the surfaces of the intermediate platen facing the fixed platen and the movable platen is a mold mounting surface on which a mold can be mounted directly or indirectly.
Public/Granted literature
- US20120219655A1 MULTILAYER MOLDING APPARATUS AND INJECTION MOLDING METHOD Public/Granted day:2012-08-30
Information query