Invention Grant
US08747122B2 Implementing connection of two large electronic boards utilizing LGA interconnect
失效
实现利用LGA互连的两个大型电子板的连接
- Patent Title: Implementing connection of two large electronic boards utilizing LGA interconnect
- Patent Title (中): 实现利用LGA互连的两个大型电子板的连接
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Application No.: US12821312Application Date: 2010-06-23
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Publication No.: US08747122B2Publication Date: 2014-06-10
- Inventor: Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
- Applicant: Terry F. Banitt , John L. Colbert , Jason R. Eagle , Roger S. Krabbenhoft
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Joan Pennington
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
Public/Granted literature
- US20140127915A1 IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LGA INTERCONNECT Public/Granted day:2014-05-08
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