Invention Grant
US08747122B2 Implementing connection of two large electronic boards utilizing LGA interconnect 失效
实现利用LGA互连的两个大型电子板的连接

Implementing connection of two large electronic boards utilizing LGA interconnect
Abstract:
A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites.
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