Invention Grant
- Patent Title: Electrical connector having grounding material
- Patent Title (中): 具有接地材料的电连接器
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Application No.: US13527346Application Date: 2012-06-19
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Publication No.: US08747158B2Publication Date: 2014-06-10
- Inventor: David S. Szczesny , John J. O'Keefe, II , Douglas M. Thomas , Eric David Briant
- Applicant: David S. Szczesny , John J. O'Keefe, II , Douglas M. Thomas , Eric David Briant
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R4/66
- IPC: H01R4/66

Abstract:
An electrical connector is provided having a housing. Contact modules are positioned within the housing. The contact modules each have a dielectric body holding at least one conductive lead. The at least one conductive lead extends between a mating end and a mounting end. The mating end is configured to be electrically connected to an electrical component. The mounting end is configured to be electrically connected to a circuit board. Ground plates are positioned within the housing between corresponding contact modules. The contact modules and the ground plates form a contact assembly held by the housing. A conductive elastomeric material extends through the contact modules and engages the ground plates to electrically interconnect the ground plates.
Public/Granted literature
- US20130337667A1 ELECTRICAL CONNECTOR HAVING GROUNDING MATERIAL Public/Granted day:2013-12-19
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