Invention Grant
- Patent Title: Connector module
- Patent Title (中): 连接器模块
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Application No.: US13531063Application Date: 2012-06-22
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Publication No.: US08747159B2Publication Date: 2014-06-10
- Inventor: Yang Liu , Lei Liu
- Applicant: Yang Liu , Lei Liu
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110350093 20111108
- Main IPC: H01R13/648
- IPC: H01R13/648

Abstract:
A connector module includes a single port connector and a circuit board capable of assembling with a multi-ports connector. The single port connector includes a receiving room and a number of first fixing pins formed at opposite sides of the receiving room along a longitudinal direction of the receiving room. The first fixing pins at each side of the receiving are arranged in a same way. The multi-ports connector includes at least two of the receiving room and the first fixing pins formed at opposite sides of each receiving room. The circuit board defines a group of first fixing holes corresponding to the first fixing pins formed at each side of the receiving rooms of the multi-ports connector. The single port connector is mounted on the circuit board by selectively inserting the first fixing pins into every two adjacent groups of the first fixing holes.
Public/Granted literature
- US20130115786A1 CONNECTOR MODULE Public/Granted day:2013-05-09
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