Invention Grant
- Patent Title: Stacking connector
- Patent Title (中): 堆叠连接器
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Application No.: US13405671Application Date: 2012-02-27
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Publication No.: US08747168B2Publication Date: 2014-06-10
- Inventor: Shinjiro Kida
- Applicant: Shinjiro Kida
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2011-048048 20110304
- Main IPC: H01R13/502
- IPC: H01R13/502

Abstract:
Each housing (10) includes terminal accommodating chambers (12), a communication opening (14) formed in an outer surface and communicating with the terminal accommodating chambers (12), and projections (16) projecting from a terminal accommodating portion (11). With the housings (10) placed one above the other, the projections (16) inserted in the terminal accommodating chambers (12) through the communication opening (14) are engaged with terminal fittings (20) in the terminal accommodating chambers (12) to retain the terminal fittings (20). Receiving portions (13) are provided in each housing (10) and each projection (16) includes a lock (18) to be engaged with the corresponding receiving portion (13) to hold the housings (10) in an assembled state.
Public/Granted literature
- US20120225576A1 CONNECTOR Public/Granted day:2012-09-06
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