Invention Grant
- Patent Title: Full tape thickness feature conductors for EMI structures
- Patent Title (中): 全磁带厚度特征用于EMI结构的导体
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Application No.: US12833262Application Date: 2010-07-09
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Publication No.: US08747591B1Publication Date: 2014-06-10
- Inventor: Kenneth A. Peterson , Richard T. Knudson , Frank R. Smith , Gregory Barner
- Applicant: Kenneth A. Peterson , Richard T. Knudson , Frank R. Smith , Gregory Barner
- Applicant Address: US NM Albuquerque
- Assignee: Sandia Corporation
- Current Assignee: Sandia Corporation
- Current Assignee Address: US NM Albuquerque
- Agent Scott B. Stahl
- Main IPC: C03B29/00
- IPC: C03B29/00 ; B29C65/00

Abstract:
Generally annular full tape thickness conductors are formed in single or multiple tape layers, and then stacked to produce an annular solid conductive wall for enclosing an electromagnetic isolation cavity. The conductors may be formed using punch and fill operations, or by flowing conductor-containing material onto the tape edge surfaces that define the interior sidewalls of the cavity.
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