Invention Grant
- Patent Title: Enclosure and method of manufacturing the same
- Patent Title (中): 外壳及其制造方法
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Application No.: US13887465Application Date: 2013-05-06
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Publication No.: US08747600B2Publication Date: 2014-06-10
- Inventor: Koji Omote , Koichi Kimura
- Applicant: Fujitsu Limited
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Kratz, Quintos & Hanson, LLP
- Main IPC: B29C51/14
- IPC: B29C51/14 ; B27D1/08

Abstract:
A core layer is formed by bonding a plurality of wooden plates together by using an adhesive. The core layer is cut into a predetermined shape having notches. The core layer is placed on a die of a pressing machine by being positioned by using the notches and pins placed on the die. The core layer is press molded to firmly hold the pin by the outer edge of the notch and to harden the adhesive.
Public/Granted literature
- US20130243983A1 ENCLOSURE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-09-19
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