A method of forming an adhesive bond between a first substrate and a second substrate includes applying a semi-crystalline polymeric adhesive composition to a bonding area of the first substrate, and, after applying, disposing the second substrate adjacent to and in contact with the composition to form a workpiece. After disposing, the method includes heating the workpiece to cure the composition and thereby form a crosslinked polymeric adhesive material. After heating, the method includes cooling the workpiece such that the material has a crystalline molecular structure. Concurrent to cooling, the method includes imposing a stress on the material to thereby orient the crystalline molecular structure in a desired direction, and, after imposing, dissipating the stress along the crystalline molecular structure in the desired direction to thereby form the adhesive bond between the first substrate and the second substrate.