Invention Grant
- Patent Title: Plasma processing apparatus and shower head
- Patent Title (中): 等离子处理装置和淋浴头
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Application No.: US12888664Application Date: 2010-09-23
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Publication No.: US08747609B2Publication Date: 2014-06-10
- Inventor: Hachishiro Iizuka , Jun Abe , Yuki Mochizuki
- Applicant: Hachishiro Iizuka , Jun Abe , Yuki Mochizuki
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2009-218726 20090924
- Main IPC: H01L21/3065
- IPC: H01L21/3065 ; C23F1/00 ; C23C16/00
Abstract:
A plasma processing apparatus includes a shower head that is installed within a processing chamber for processing a substrate therein so as to face a mounting table for mounting the substrate thereon and supplies a gas toward the substrate in a shower pattern through a plurality of gas discharge holes provided in a facing surface of the shower head facing the mounting table; a plurality of gas exhaust holes formed through the shower head to be extended from the facing surface of the shower head to an opposite surface from the facing surface; a multiple number of rod-shaped magnet pillars standing upright in a gas exhaust space communicating with the gas exhaust holes on the side of the opposite surface; and a driving unit that varies a distance between the magnet pillars and the gas exhaust holes by moving at least a part of the magnet pillars.
Public/Granted literature
- US20110067815A1 PLASMA PROCESSING APPARATUS AND SHOWER HEAD Public/Granted day:2011-03-24
Information query
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