Invention Grant
US08747611B2 Apparatus and method for treating substrate, and injection head used in the Apparatus
有权
用于处理基板的装置和方法以及在装置中使用的注射头
- Patent Title: Apparatus and method for treating substrate, and injection head used in the Apparatus
- Patent Title (中): 用于处理基板的装置和方法以及在装置中使用的注射头
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Application No.: US11805758Application Date: 2007-05-24
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Publication No.: US08747611B2Publication Date: 2014-06-10
- Inventor: Hyun-Jong Kim , Young-Ki Ahn
- Applicant: Hyun-Jong Kim , Young-Ki Ahn
- Applicant Address: KR Chungcheongnam-do
- Assignee: Semes Co. Ltd
- Current Assignee: Semes Co. Ltd
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Jenkins, Wilson, Taylor & Hunt, P.A.
- Priority: KR10-2006-0047217 20060525
- Main IPC: B05C11/02
- IPC: B05C11/02 ; H01L21/30

Abstract:
Provided are an injection head, and a substrate treatment apparatus and method using the same. The substrate treatment apparatus includes a rotatable spin head supporting a substrate, an injection head installed on the spin head to supply a fluid to a bottom surface of the substrate supported on the spin head, and a fluid supply unit supplying the fluid to the injection head. The injection head includes a body disposed below a center region of the substrate supported on the spin head to receive the fluid from the fluid supply unit and a injection member extending from the body to an edge region of the substrate supported on the spin head to inject the fluid supplied from the body to the bottom surface of the substrate, the injection member having first injection openings injecting the fluid to the edge region of the substrate and second injection openings injecting the fluid to a middle region disposed between the center region and the edge region, and a flow path through which the fluid is supplied to the first injection openings and then to the second injection openings.
Public/Granted literature
- US20070275562A1 Apparatus and method for treating substrate, and injection head used in the apparatus Public/Granted day:2007-11-29
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