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US08747642B2 Superfilling secondary metallization process in MEMS fabrication 有权
在MEMS制造中超补充二次金属化工艺

  • Patent Title: Superfilling secondary metallization process in MEMS fabrication
  • Patent Title (中): 在MEMS制造中超补充二次金属化工艺
  • Application No.: US12608857
    Application Date: 2009-10-29
  • Publication No.: US08747642B2
    Publication Date: 2014-06-10
  • Inventor: Montray Leavy
  • Applicant: Montray Leavy
  • Applicant Address: US CA San Jose
  • Assignee: Advantest America, Inc.
  • Current Assignee: Advantest America, Inc.
  • Current Assignee Address: US CA San Jose
  • Agent Manuel de la Cerra
  • Main IPC: C25D5/48
  • IPC: C25D5/48
Superfilling secondary metallization process in MEMS fabrication
Abstract:
Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and a sacrificial secondary metal that provides structural support for the primary metal component during machining. More specifically, techniques are disclosed to increase the rate of secondary metal deposition between primary metal features in order to prevent voiding in the sacrificial secondary metal and thus enhance structural support of the primary metal during machining.
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