Invention Grant
- Patent Title: Shape simulation apparatus, shape simulation program, semiconductor production apparatus, and semiconductor device production method
- Patent Title (中): 形状模拟装置，形状仿真程序，半导体制造装置和半导体装置制造方法
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Application No.: US13972676Application Date: 2013-08-21
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Publication No.: US08747685B2Publication Date: 2014-06-10
- Inventor: Nobuyuki Kuboi , Takashi Kinoshita , Tetsuya Tatsumi
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: The Chicago Technology Law Group, LLC
- Agent Robert J. Depke
- Priority: JP2009-193334 20090824
- Main IPC: G06F19/00
- IPC: G06F19/00
Abstract:
Disclosed herein is a shape simulation apparatus including: a flux computation block configured to compute the flux of particles incident on the surface of a wafer covered with a mask; and a shape computation block configured to compute a surface shape of the wafer by allowing the coordinates of a plurality of calculation points established on the surface of the wafer to be time-evolved based on the incident flux computed.
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