Invention Grant
- Patent Title: Method for manufacturing insert-molded cover
- Patent Title (中): 插入成型盖的制造方法
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Application No.: US13171707Application Date: 2011-06-29
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Publication No.: US08747719B2Publication Date: 2014-06-10
- Inventor: Han-Ming Lee , Chih-Chien Hung , Hsiang-Sheng Chou , Ching-Hsien Chang
- Applicant: Han-Ming Lee , Chih-Chien Hung , Hsiang-Sheng Chou , Ching-Hsien Chang
- Applicant Address: TW New Taipei
- Assignee: Foxconn Technology Co., Ltd.
- Current Assignee: Foxconn Technology Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN200810301531 20080509
- Main IPC: H05K5/02
- IPC: H05K5/02 ; H05K5/00 ; B05D3/00 ; B05D3/12 ; B28B7/38
Abstract:
A method for manufacturing an insert-molded cover for electronic devices, including manufacturing a metallic body, processing the metallic body by a chemical method and forming an oxide film on a surface of the metallic body, and molding a plastic antenna lid on the metallic body by insert molding so that the plastic antenna lid is attached on the oxide film.
Public/Granted literature
- US20110256310A1 METHOD FOR MANUFACTURING INSERT-MOLDED COVER Public/Granted day:2011-10-20
Information query
