Invention Grant
- Patent Title: Method for producing a master mold and cutout processing method for a master mold
- Patent Title (中): 一种母模的制造方法和主模的切割加工方法
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Application No.: US13799784Application Date: 2013-03-13
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Publication No.: US08747943B2Publication Date: 2014-06-10
- Inventor: Kohtaro Tashiro , Katsuhiro Nishimaki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-203961 20100913
- Main IPC: B05D5/12
- IPC: B05D5/12 ; H01L21/302 ; H01L21/461
Abstract:
A metal plate having a pattern of protrusions on a first surface thereof is produced; photoresist is provided on a second surface of the metal plate; the photoresist is removed from a portion of the metal plate corresponding to a loop shaped outer peripheral cutout region that contacts the outer periphery of a mold region of the metal plate; and the metal plate is etched using the remaining photoresist as a mask, in a method for producing and a method for cutting a processing a master mold having a pattern of protrusions and recesses corresponding to data to be transferred on a surface thereof.
Public/Granted literature
- US20130193107A1 METHOD FOR PRODUCING A MASTER MOLD AND CUTOUT PROCESSING METHOD FOR A MASTER MOLD Public/Granted day:2013-08-01
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