Invention Grant
- Patent Title: Packaging material for boil/retort treatment and pouch
- Patent Title (中): 用于煮/蒸煮处理和包装的包装材料
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Application No.: US13753673Application Date: 2013-01-30
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Publication No.: US08747972B2Publication Date: 2014-06-10
- Inventor: Noriko Sakamoto , Noriyuki Shiina , Eriko Tsukuda , Mitsuru Bushida
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2012-018631 20120131; JP2012-120602 20120528
- Main IPC: B29D22/00
- IPC: B29D22/00 ; B32B27/00 ; B65D81/34

Abstract:
To provide a packaging material for boiling treatment or retort treatment that is inexpensive and has excellent low-elution properties and transparency, as well as a pouch comprising the same.A packaging material for boil/retort treatment having at least a transparent gas barrier film layer, an adhesive layer and a sealant film layer in that order, the packaging material for boil/retort treatment being one in which, when it is heated at 121° C. for 2 hours by contact with a sufficient amount of 95% ethanol in a one-side elution test, the masses of the unreacted residual ε-caprolactam and ω-laurolactam eluting into the 95% ethanol are no greater than 0.15 mg and no greater than 0.04 mg, respectively, per square inch of the sealant film layer, and a pouch comprising the material.
Public/Granted literature
- US20130196099A1 PACKAGING MATERIAL FOR BOIL/RETORT TREATMENT AND POUCH Public/Granted day:2013-08-01
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