Invention Grant
- Patent Title: Method of cleaning substrate
- Patent Title (中): 清洗基材的方法
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Application No.: US13455740Application Date: 2012-04-25
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Publication No.: US08748062B2Publication Date: 2014-06-10
- Inventor: Kazuto Yamauchi , Tsutomu Shoki , Takeyuki Yamada
- Applicant: Kazuto Yamauchi , Tsutomu Shoki , Takeyuki Yamada
- Applicant Address: JP Osaka JP Tokyo
- Assignee: Osaka University,Hoya Corporation
- Current Assignee: Osaka University,Hoya Corporation
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-098480 20110426
- Main IPC: B08B3/04
- IPC: B08B3/04 ; B08B3/02
Abstract:
The present invention is a method of cleaning a substrate, comprising cleaning at least one surface of a substrate located in a liquid by injecting pressurized cleaning liquid containing bubbles or cleaning particles from a injection nozzle to at least one surface of the substrate.
Public/Granted literature
- US20120276474A1 METHOD OF CLEANING SUBSTRATE Public/Granted day:2012-11-01
Information query
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