Invention Grant
US08748085B2 Use of photosensitized Epon epoxy resin 1002F for MEMS and bioMEMS applications 有权
光敏Epon环氧树脂1002F用于MEMS和bioMEMS应用

Use of photosensitized Epon epoxy resin 1002F for MEMS and bioMEMS applications
Abstract:
Systems and methods directed to the use 1002F to build microdevices and biomedical devices. Through the addition of a photosensitizing agent, Epon epoxy resin 1002F can be linked in the presence of UV light, making it useful as a photoresist or as a micropatternable structural material. One embodiment comprises combining 1002F monomer resin with a solvent and a photoinitiator, placing the monomer solution on a surface, exposing the monomer solution to UV light through a mask to initiate linking, and stripping the unlinked polymer away. In another embodiment, 3-D structures are built using two or more layers of sensitized monomer films, each having different sensitivity to light, and the use of a mask containing opaque and semi-opaque regions.
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