Invention Grant
- Patent Title: Ultra high voltage SiGe HBT and manufacturing method thereof
- Patent Title (中): 超高电压SiGe HBT及其制造方法
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Application No.: US13680506Application Date: 2012-11-19
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Publication No.: US08748238B2Publication Date: 2014-06-10
- Inventor: Donghua Liu , Jing Shi , Wenting Duan , Wensheng Qian , Jun Hu
- Applicant: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Applicant Address: CN Shanghai
- Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee: Shanghai Hua Hong NEC Electronics Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: MKG, LLC
- Priority: CN201110370460 20111121
- Main IPC: H01L21/335
- IPC: H01L21/335

Abstract:
An ultra high voltage silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) is disclosed, in which, a collector region is formed between two isolation structures; a pseudo buried layer is formed under each isolation structure and each side of the collector region is connected with a corresponding pseudo buried layer; a SiGe field plate is formed on each of the isolation structures; each pseudo buried layer is picked up by a first contact hole electrode and each SiGe field plate is picked up by a second contact hole electrode; and each first contact hole electrode is connected to its adjacent second contact hole electrode and the two contact hole electrodes jointly serve as an emitter. A manufacturing method of the ultra high voltage SiGe HBT is also disclosed.
Public/Granted literature
- US20130126945A1 ULTRA HIGH VOLTAGE SIGE HBT AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-05-23
Information query
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