Invention Grant
US08748293B2 Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
有权
有机聚硅氧烷,含有机聚硅氧烷的临时粘合剂组合物,以及使用其制造薄片晶片的方法
- Patent Title: Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
- Patent Title (中): 有机聚硅氧烷,含有机聚硅氧烷的临时粘合剂组合物,以及使用其制造薄片晶片的方法
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Application No.: US13406114Application Date: 2012-02-27
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Publication No.: US08748293B2Publication Date: 2014-06-10
- Inventor: Masahiro Furuya , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Hideto Kato
- Applicant: Masahiro Furuya , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Hideto Kato
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-98324 20110426
- Main IPC: H01L21/461
- IPC: H01L21/461 ; H01L21/463 ; C08G77/20

Abstract:
The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.
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