Invention Grant
US08748293B2 Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same 有权
有机聚硅氧烷,含有机聚硅氧烷的临时粘合剂组合物,以及使用其制造薄片晶片的方法

Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same
Abstract:
The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.
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