Invention Grant
- Patent Title: Cleaning residual molding compound on solder bumps
- Patent Title (中): 在焊料凸块上清洁残留的模塑料
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Application No.: US13198767Application Date: 2011-08-05
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Publication No.: US08748306B2Publication Date: 2014-06-10
- Inventor: Yi-Yang Lei , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- Applicant: Yi-Yang Lei , Hung-Jui Kuo , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/22 ; H01L23/48
Abstract:
A method of forming wafer-level chip scale packaging solder bumps on a wafer substrate involves cleaning the surface of the solder bumps using a laser to remove any residual molding compound from the surface of the solder bumps after the solder bumps are reflowed and a liquid molding compound is applied and cured.
Public/Granted literature
- US20130034956A1 CLEANING RESIDUAL MOLDING COMPOUND ON SOLDER BUMPS Public/Granted day:2013-02-07
Information query
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