Invention Grant
US08748318B2 Methods of forming patterns in semiconductor constructions, methods of forming container capacitors, and methods of forming reticles configured for imprint lithography
有权
在半导体结构中形成图案的方法,形成容器电容器的方法,以及形成用于压印光刻的掩模版的方法
- Patent Title: Methods of forming patterns in semiconductor constructions, methods of forming container capacitors, and methods of forming reticles configured for imprint lithography
- Patent Title (中): 在半导体结构中形成图案的方法,形成容器电容器的方法,以及形成用于压印光刻的掩模版的方法
-
Application No.: US13330973Application Date: 2011-12-20
-
Publication No.: US08748318B2Publication Date: 2014-06-10
- Inventor: Gurtej S. Sandhu
- Applicant: Gurtej S. Sandhu
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/461

Abstract:
The invention includes methods of forming reticles configured for imprint lithography, methods of forming capacitor container openings, and methods in which capacitor container openings are incorporated into DRAM arrays. An exemplary method of forming a reticle includes formation of a radiation-imageable layer over a material. A lattice pattern is then formed within the radiation-imageable layer, with the lattice pattern defining a plurality of islands of the radiation-imageable layer. The lattice-patterned radiation-imageable layer is utilized as a mask while subjecting the material under the lattice-patterned layer to an etch which transfers the lattice pattern into the material. The etch forms a plurality of pillars which extend only partially into the material, with the pillars being spaced from one another by gaps. The gaps are subsequently narrowed with a second material which only partially fills the gaps.
Public/Granted literature
Information query
IPC分类: