Invention Grant
- Patent Title: Patterning method
- Patent Title (中): 图案化方法
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Application No.: US12217645Application Date: 2008-07-07
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Publication No.: US08748323B2Publication Date: 2014-06-10
- Inventor: Han-Hui Hsu , Shih-Ping Hong , An-Chi Wei , Ming-Tsung Wu
- Applicant: Han-Hui Hsu , Shih-Ping Hong , An-Chi Wei , Ming-Tsung Wu
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L21/3105 ; H01L21/314
Abstract:
A patterning method is provided. First, a substrate having an objective material layer thereon is provided. Thereafter, a mask layer is formed on the objective material layer. Afterwards, a patterned layer is formed over the mask layer, wherein a material of the patterned layer includes a metal-containing substance. Then, the mask layer is patterned to form a patterned mask layer. Further, the objective material layer is patterned, using the patterned mask layer as a mask.
Public/Granted literature
- US20100000969A1 Patterning method Public/Granted day:2010-01-07
Information query
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