Invention Grant
- Patent Title: Systems and methods for separating components of a multilayer stack of electronic components
- Patent Title (中): 用于分离电子部件的多层堆叠的部件的系统和方法
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Application No.: US13777334Application Date: 2013-02-26
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Publication No.: US08748324B1Publication Date: 2014-06-10
- Inventor: Robyn L. Woo , Xiaobo Zhang , Christopher M. Fetzer , Eric M. Rehder
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: DASCENZO Intellectual Property Law, P.C.
- Main IPC: H01L21/3063
- IPC: H01L21/3063 ; H01L21/465 ; C25F3/12 ; C25F3/14
Abstract:
Systems and methods for separating components of a multilayer stack of electronic components. The multilayer stack includes an electronic assembly, a substrate, and a sacrificial anode portion that is located between the electronic assembly and the substrate and that operatively attaches the electronic assembly to the substrate. The systems and methods may include locating the multilayer stack within an electrically conductive fluid to form an electrochemical cell. The systems and methods further may include generating a potential difference between a cathode portion of the electronic assembly and the sacrificial anode portion such that the cathode portion forms a cathode of the electrochemical cell and the sacrificial anode portion forms an anode of the electrochemical cell. The systems and methods additionally may include separating the electronic assembly from the substrate by electrochemically oxidizing the sacrificial anode portion to dissolve the sacrificial anode portion within the electrically conductive solution.
Information query
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