Invention Grant
- Patent Title: Electric circuit with vertical contacts
- Patent Title (中): 电路垂直接触
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Application No.: US12664318Application Date: 2008-06-16
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Publication No.: US08748944B2Publication Date: 2014-06-10
- Inventor: Ingo Daumiller , Ertugrul Soenmez , Mike Kunze
- Applicant: Ingo Daumiller , Ertugrul Soenmez , Mike Kunze
- Applicant Address: DE Ulm
- Assignee: MicroGan GmbH
- Current Assignee: MicroGan GmbH
- Current Assignee Address: DE Ulm
- Agency: Fay Kaplun & Marcin, LLP
- Priority: DE102007028458 20070618
- International Application: PCT/EP2008/004838 WO 20080616
- International Announcement: WO2008/155085 WO 20081224
- Main IPC: H01L27/10
- IPC: H01L27/10 ; H01L29/74 ; H01L29/73 ; H01L23/52 ; H01L23/48 ; H01L29/40

Abstract:
An electrical circuit includes at least two unit cells configured on a planar substrate which extends in one plane. The unit cells respectively have at least two contact points with a different function and include at least one dielectric layer disposed on the substrate and/or on the unit cells and at least two contact surfaces which are disposed parallel to the plane above the contact points and/or the substrate. The contact points with the same function are connected electrically to at least one common contact surface for at least a part of the contact points of the same function via at least one through-contacting through the dielectric layer and able to be contacted in common from outside via the corresponding contact surfaces.
Public/Granted literature
- US20100230727A1 Electric Circuit with Vertical Contacts Public/Granted day:2010-09-16
Information query
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