A multi-layer integrated circuit package includes a switched-mode power supply circuit including a plurality of transistors which form part of a main current loop of the switched-mode power supply circuit. The plurality of transistors are arranged in one or more layers of the integrated circuit package. The package further includes a conductive plate arranged in a different layer of the integrated circuit package than the plurality of transistors. The conductive plate is in close enough proximity to at least part of the main current loop so that a current can be electromagnetically induced in the conductive plate responsive to a change in current in the main current loop.